Circuit configuration, showing the schematic and Bill of Materials (BOM) table for nRF7002 WLCSP package.
| Designator | Value | Description | Note |
|---|---|---|---|
| U1 | nRF7002-CEAA | Wi-Fi 6 Dual Band companion chip WLCSP | |
| F1 | Signal Conditioning 2.4GHz and 5GHz Diplexer | ||
| X1 | 40 MHz | Crystal SMD 1612, 40 MHz, Cl=8 pF | ESR max 100 Ω |
| L1 | 3.3 µH | Inductor, 1 A, ±20%, 200 mΩ | |
| C1, C2, C6, C11 | 4.7 µF | Capacitor, Ceramic, 4.7 µF 25 V X6S 0603, ±10% |
Place C1 close to BUCKVBAT pin Place C2 close to inductor L1 Place C11 close to PALDO pin |
| C3 | 0.22 uF | Capacitor, Ceramic, 0.22 µF 10 V X5R 0201, ±10% |
Place C3 close to RFBUCKVDD pin |
| C4, C14 | 0.47 uF | Capacitor, Ceramic, 0.47 µF 6.3 V X5R 0201, ±10% |
Place C4 close to PWRBUCKVDD pin |
| C5 | 1.0 µF | Capacitor, Ceramic, 1.0 µF 35 V X5R 0402, ±10% | |
| C7 | 2.2 µF | Capacitor, Ceramic, 2.2 µF 16 V X7S 0603, ±10% |
Place C7 close to BUCKVBATS pin |
| C8 | 10 nF | Capacitor, Ceramic, 10 nF 16 V X7R 0201, ±10% | |
| C9, C18 | 2.2 µF | Capacitor, Ceramic, 2.2 µF 25 V X5R 0402, ±10% | |
| C10 | 1.0 µF | Capacitor, Ceramic, 1.0 µF 16 V X6S 0402, ±10% | |
| C12, C17 | 100 nF | Capacitor, Ceramic, 100 nF 16 V X7S 0201, ±10% |
Place C12 close to PAVDD0 pin |
| C13 | 22 nF | Capacitor, Ceramic, 22 nF 10 V X5R 0201, ±10% | |
| C15 | 2.2 µF | Capacitor, Ceramic, 2.2 µF 10 V X5R 0201, ±10% | |
| C16 | 1.0 µF | Capacitor, Ceramic, 1.0 µF 10 V X7S 0402, ±10% |
Note: If the design uses separate low-band and high-band
antennas instead of a diplexer, a low-pass filter will be required on each of the antenna ports.
The low-band filter needs to provide 20 dB attenuation above 7 GHz, while the high-band filter
needs to provide 30 dB attenuation above 15 GHz.