The Chip Scale Package (CSP) also known as Wafer Level Chip Scale Package (WLCSP) is a die sized package where a redistribution layer (RDL) re-arranges the pins to form a ball-grid array on the underside of the bare die. CSP
The Chip Scale Package (CSP) also known as Wafer Level Chip Scale Package (WLCSP) is a die sized package where a redistribution layer (RDL) re-arranges the pins to form a ball-grid array on the underside of the bare die. CSP