The glossary contains terms and acronyms that are used in this document.
Development Kit (DK)
A hardware development platform used for application development.
DK
Electrostatic Discharge (ESD)
A sudden discharge of electric current between two electrically charged
objects.
ESD
Expansion Board (EB)
A printed circuit board assembly that can be connected to other development hardware
to give it added functionalities and features.
EB
General-Purpose Input/Output (GPIO)
A digital signal pin that can be used as input, output, or both. It is uncommitted and can be controlled by the user at runtime.
GPIO
Integrated Circuit (IC)
A semiconductor chip consisting of fabricated transistors, resistors, and capacitors.
IC
One Time Programmable (OTP) memory
A type of non-volatile memory that permits data to be written to memory only
once.
OTP memory
Printed Circuit Board (PCB)
A board that connects electronic components.
PCB
Quad Serial Peripheral Interface (QSPI)
A Serial Peripheral Interface (SPI) controller that allows the use of multiple data
lines.
QSPI
Root Mean Square (RMS)
An RMS meter calculates the equivalent Direct Current (DC) value of an Alternating Current (AC) waveform. A true RMS meter can accurately measure both pure waves and the more complex nonsinusoidal waves.
RMS
Serial Peripheral Interface (SPI)
Synchronous serial communication interface specification used for short-distance
communication.
SPI
Single-Input Single-Output (SISO)
The use of only one antenna for transmission and reception.
SISO
Universal Serial Bus (USB)
An industry standard that establishes specifications for cables and connectors and
protocols for connection, communication, and power supply between computers, peripheral devices,
and other computers.