Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the device can be found below.

Table 1. Package thermal characteristics

Symbol	Package	Typ.	Unit
θJA,CSP	CSP98	34.94	°C/W
θJC,CSP	CSP98	8.16	°C/W

Values for θ_JA are obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.

Values for θ_JC are obtained by simulation. A cold plate and the grease between package and cold plate are modeled.