| A | A1 | A2 | A3 | A5 | D | E | D2 | E2 | b | e | e2 | e3 | F | G | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Min. | 0.3886 | 0.0916 | 0.275 | 0.022 | 2.987 | 2.4013 | 2.585 | 1.935 | 0.185 | 0.310 | |||||
| Nom. | 0.4316 | 0.3 | 0.03 | 0.025 | 3.017 | 2.4313 | 2.600 | 1.950 | 0.325 | 0.07 | 0.39 | 1.005 | 1.3 | ||
| Max. | 0.4746 | 0.1216 | 0.325 | 0.028 | 3.047 | 2.4613 | 2.615 | 1.965 | 0.215 | 0.340 |
This CSP package uses WLCSP (Wafer Level Chip Scale Package) package technology.