Follow the design recommendations for trace width and vias.
For high current paths, trace widths must be considered based on the maximum load condition to minimize the voltage drop and inductance.
Via current capabilities must be considered and calculated. The use of more and bigger vias is always better for voltage drop and reduced inductance.
Place ground vias close to the signal via for signal integrity and reduced return path impedance.
Use via stitching to couple the ground plane and ground pours strongly together.