The operating conditions are the physical parameters that the chip can operate within.

Table 1. Recommended operating conditions
Parameter Min. Max. Units
Supply voltage VBAT 0.7 3.4 V
Junction temperature TJ -40 105 °C
Ambient temperature TA -40 85 °C

Dissipation ratings

Thermal resistances and thermal characterization parameters as defined by JESD51-7 are shown in the following tables.

Table 2. Thermal resistances and characterization parameters, WLCSP
Symbol Parameter Value Units
RϴJA Junction-to-ambient thermal resistance 58 °C/W
RϴJC(top) Junction-to-case (top) thermal resistance 11 °C/W
RϴJB Junction-to-board thermal resistance 26 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 26.6 °C/W
Table 3. Thermal resistances and characterization parameters, QFN
Symbol Parameter Value Units
RϴJA Junction-to-ambient thermal resistance 40 °C/W
RϴJC(top) Junction-to-case (top) thermal resistance 22 °C/W
RϴJB Junction-to-board thermal resistance 20 °C/W
ΨJT Junction-to-top characterization parameter 0.75 °C/W
ΨJB Junction-to-board characterization parameter 19.9 °C/W

WLCSP light sensitivity

WLCSP package is sensitive to visible and near infrared light, which means that a final product design must shield the chip properly.