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<meta name="abstract" content="It is recommended to test the assembled product at the RF level, ensuring all discrete components are correctly fitted and the RF paths (independent 2.4 GHz and 5 GHz) from the chip pins to the antenna are verified." />
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 <h1 class="title topictitle1" id="ariaid-title1">Assembly test</h1>

 
 
 <div class="body conbody"><p class="shortdesc">It is recommended to test the assembled product at the RF level, ensuring all discrete
  components are correctly fitted and the RF paths (independent 2.4 GHz and 5 GHz) from the chip
  pins to the antenna are verified.</p>
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<li class="link ulchildlink"><strong><a href="../../APP/nan_043/assembly_test_method.html">Test method</a></strong><br />
Since the TX and RX paths are common from the chip pin to the antenna, it is sufficient   to only test in the TX direction.</li>
<li class="link ulchildlink"><strong><a href="../../APP/nan_043/assembly_test_alternative.html">Alternative method</a></strong><br />
The received signal power can be checked while performing crystal/crystal oscillator   trimming. However, this is typically only conducted on a single band, so an additional check of   the other band is recommended.</li>
</ul>

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<div class="parentlink"><strong>Parent topic:</strong> <a class="link" href="../../APP/nan_043/production_line.html" title="This section provides a summary of recommended and optional steps.">Production line operations</a></div>
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